phone pcb design ,FR4 substrate PCB

1. phone pcb and company advantage :High quality phone pcb, professional service,low cost pcb Reputable manufacturer , own factory UL,SGS,ISO,TS,CQC certification OEM and ODM serviceKeep cost to minim

  • Model: phone pcb design ,FR4 substrate PCB

1. phone pcb and company advantage :

High quality phone pcb, professional service,low cost pcb 

Reputable manufacturer , own factory 

UL,SGS,ISO,TS,CQC certification 

OEM and ODM service

Keep cost to minimum , maximize your benefit

Quick delivery time 



2.The detailed specification of phone pcb :


FR4, High TG FR4, Halogen Free material, CEM-3, Rogers HF material, etc.

Layer counts

2-28 layers

Finished Copper Thickness

0.5-5 OZ

Finished Board Thickness


Min. Line/Track Width 


Min. Line/Track Space


Min. Contour Tolerance


Min. Finished Diameter of PTH Hole


Max. Board Thickness/Hole Ratio


Min. Solder Mask Bridge

4mil (Min. SMT Pad Space 8mil)

Min. Legend (Silk screen) Track Width


Min. Legend (Silk screen) Height


Min. drilling slot size


Solder mask color

green, black, blue, white, yellow, purple, and matt, etc.

Solder mask hardness


Legend/Silk screen Color

white, yellow, black, etc.

Surface Treatment

HAL, Lead Free HAL, Immersion gold, OSP, Immersion tin, Immersion silver, etc.

Other Technology

Gold finger, peelable mask, Non-across blind/buried vias, characteristic impedance control, Rigid-flex board etc.

Reliability Test

flying probe test/fixture test, impedance test, solderability test, thermal shock test, hole resistance test, and micro metallographic section analysis, etc.

Wrap and twist




Detailed Terms for PCB Assembly:

Technical Requirement

Professional Surface-mounting and Through-hole soldering Technology

Various sizes like 1206, 0805, 0603 components SMT technology

ICT(In Circuit Test), FCT(Functional Circuit Test) technology

PCB Assembly With UL, CE, FCC, Rohs Approval

Nitrogen gas reflow soldering technology for SMT

High Standard SMT&Solder Assembly Line

High density interconnected board placement technology capacity

Quote&Production Requirement

Gerber File or PCB File for Bare PCB Board Fabrication

BOM(Bill of Material) for Assembly, PNP(Pick and Place file) and Components Position also needed in assembly

To reduce the quote time, please provide us the full part number for each components, Quantity per board also the quantity for orders.

Testing Guide&Function Testing method to ensure the quality to reach nearly 0% scrap rate

OEM/ODM/EMS Services

PCBA, PCB assembly: SMT & PTH & BGA

PCBA and enclosure design

Components sourcing and purchasing

Quick prototyping

Plastic injection molding

Metal sheet stamping

Final assembly

Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)

Custom clearance for material importing and product exporting

Other  PCB AssemblyEquipment


Reflow Oven: FolunGwin FL-RX860

Wave Soldering Machine: FolunGwin ADS300

Automated Optical Inspection (AOI): Aleader ALD-H-350B,X-RAY Testing Service

Fully Automatic SMT Stencil Printer: FolunGwin Win-5